GÖPEL - Solder Paste Inspection (SPI)

Forside Spi 500X283

SPI Line 3D is a new 3D Solder Paste Inspection System from Göpel Electronic that fulfils the future needs for effective process optimization combined with the required speed. The system gives you precise two and three-dimensional solder paste printing measurements.

Key parameters

  • Camera head optimized for speed
  • 180 images per second at 4-megapixel resolution
  • Very precise 3D image capturing based on fringe projection technology
  • Measurement head operating without moving parts
  • Double-sided projection for 100% shadow-free measurement
  • Intuitive software SPI-Pilot - program generation in less than 10 minutes
  • Advanced coplanarity function for inspecting sintering paste
  • Touchscreen interface

Effective process optimization

  • Repeatable measuring
  • Statistical process control (SPC)
  • Closed loop to printer
  • Link to AOI/AXI repair station

Standard measurement range

  • X/Y offset
  • Pad area
  • Bridges (smearing)
  • Volume
  • Shape
  • Height